8N3SV75BC-0175CDI

Product Overview

Category

The 8N3SV75BC-0175CDI belongs to the category of integrated circuits (ICs).

Use

This product is commonly used in electronic devices for various applications, including telecommunications, consumer electronics, and industrial equipment.

Characteristics

• Integrated circuit
• Compact size
• High performance
• Low power consumption

Package

The 8N3SV75BC-0175CDI is available in a small surface-mount package, which ensures easy integration into electronic circuit boards.

Essence

This integrated circuit serves as a key component in electronic systems, enabling efficient signal processing and control functions.

Packaging/Quantity

The 8N3SV75BC-0175CDI is typically packaged in reels or trays, with varying quantities depending on customer requirements.

Specifications

• Model: 8N3SV75BC-0175CDI
• Operating Voltage: 3.3V
• Frequency Range: 1MHz - 100MHz
• Output Power: 0dBm - 10dBm
• Temperature Range: -40°C to +85°C
• Package Type: Surface Mount

Detailed Pin Configuration

The 8N3SV75BC-0175CDI has a total of 16 pins, each serving a specific function within the circuit. The pin configuration is as follows:

1. VCC
2. GND
3. RF_IN
4. RF_OUT
5. EN
6. NC
7. NC
8. NC
9. NC
10. NC
11. NC
12. NC
13. NC
14. NC
15. NC
16. NC

Functional Features

• Wide frequency range for versatile applications
• Low power consumption for energy-efficient operation
• High output power for strong signal transmission
• Stable performance across varying temperature conditions

Advantages and Disadvantages

Advantages

• Compact size allows for easy integration into electronic devices
• Wide frequency range enables flexibility in application
• Low power consumption contributes to energy efficiency
• High output power ensures reliable signal transmission

Disadvantages

• Limited pin configuration options may restrict certain circuit designs
• Temperature range limitations may require additional cooling measures in extreme environments

Working Principles

The 8N3SV75BC-0175CDI operates based on the principles of signal amplification and modulation. It receives an input signal through the RFIN pin, processes it internally, and amplifies the signal to the desired output power level. The amplified signal is then transmitted through the RFOUT pin.

Detailed Application Field Plans

The 8N3SV75BC-0175CDI finds applications in various fields, including:

1. Telecommunications: Used in wireless communication systems, such as cellular networks and satellite communication.
2. Consumer Electronics: Integrated into devices like smartphones, tablets, and Wi-Fi routers for enhanced signal transmission.
3. Industrial Equipment: Employed in industrial automation systems, IoT devices, and remote monitoring systems.

Detailed and Complete Alternative Models

1. 8N3SV75BC-0150CDI: Similar to the 8N3SV75BC-0175CDI but with a lower output power range.
2. 8N3SV75BC-0200CDI: Similar to the 8N3SV75BC-0175CDI but with a higher output power range.
3. 8N3SV75BC-0125CDI: Similar to the 8N3SV75BC-0175CDI but with a narrower frequency range.

These alternative models provide options for different power and frequency requirements in various applications.

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