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IUGHF66-32831-30
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IUGHF66-32831-30

Product Overview

Category

The IUGHF66-32831-30 belongs to the category of electronic components.

Use

It is used for electrical circuit connections and signal transmission in various electronic devices.

Characteristics

  • High conductivity
  • Compact size
  • Durable material
  • Reliable performance

Package

The IUGHF66-32831-30 comes in a protective anti-static packaging to prevent damage during transportation and storage.

Essence

This product serves as a crucial component in ensuring efficient electrical connectivity within electronic systems.

Packaging/Quantity

The IUGHF66-32831-30 is typically packaged in quantities of 100 units per pack.

Specifications

  • Material: Copper alloy
  • Size: 3mm x 3mm
  • Voltage Rating: 250V
  • Current Rating: 5A
  • Operating Temperature: -40°C to 85°C

Detailed Pin Configuration

The IUGHF66-32831-30 features a standard pin configuration with precise dimensions for seamless integration into circuit boards.

Functional Features

  • Low contact resistance
  • High mechanical strength
  • RoHS compliant
  • Suitable for surface mount technology (SMT) applications

Advantages

  • Excellent electrical conductivity
  • Compact design for space-saving installations
  • Wide operating temperature range
  • Compliant with environmental regulations

Disadvantages

  • Limited current-carrying capacity compared to larger connectors
  • Requires specialized equipment for soldering due to small size

Working Principles

The IUGHF66-32831-30 operates based on the principles of electrical conduction, providing a reliable pathway for current flow within electronic circuits.

Detailed Application Field Plans

The IUGHF66-32831-30 is commonly used in: - Consumer electronics - Telecommunications equipment - Automotive electronics - Industrial control systems

Detailed and Complete Alternative Models

  1. IUGHF66-32831-31
    • Similar specifications and characteristics
    • Different pin configuration for specific applications
  2. IUGHF66-32831-32
    • Enhanced current-carrying capacity
    • Larger size for easier handling and soldering

In conclusion, the IUGHF66-32831-30 is a vital electronic component with versatile applications across various industries, offering reliable electrical connectivity and compact design for modern electronic devices.

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Texniki həllərdə IUGHF66-32831-30 tətbiqi ilə bağlı 10 ümumi sual və cavabı sadalayın

  1. What is IUGHF66-32831-30?

    • IUGHF66-32831-30 is a high-performance industrial adhesive designed for use in technical solutions.

  2. What materials can IUGHF66-32831-30 bond?

    • IUGHF66-32831-30 is suitable for bonding a wide range of materials including metals, plastics, composites, and ceramics.

  3. What is the recommended application temperature for IUGHF66-32831-30?

    • The recommended application temperature for IUGHF66-32831-30 is between 65°F to 100°F (18°C to 38°C).

  4. How long does it take for IUGHF66-32831-30 to cure?

    • The curing time for IUGHF66-32831-30 varies depending on the specific application and environmental conditions, but typically ranges from 24 to 72 hours.

  5. Is IUGHF66-32831-30 resistant to chemicals and solvents?

    • Yes, IUGHF66-32831-30 exhibits excellent resistance to a wide range of chemicals and solvents, making it suitable for demanding industrial applications.

  6. Can IUGHF66-32831-30 be used for outdoor applications?

    • Yes, IUGHF66-32831-30 is formulated to withstand outdoor exposure and is resistant to UV radiation, moisture, and temperature fluctuations.

  7. What is the shelf life of IUGHF66-32831-30?

    • When stored in its original unopened container at the recommended temperature, IUGHF66-32831-30 has a shelf life of approximately 12 months.

  8. Does IUGHF66-32831-30 require surface preparation before application?

    • Yes, for optimal adhesion, surfaces should be clean, dry, and free from contaminants such as oil, grease, and dust prior to applying IUGHF66-32831-30.

  9. Can IUGHF66-32831-30 be used in structural bonding applications?

    • Yes, IUGHF66-32831-30 is suitable for structural bonding where high strength and durability are required.

  10. Is IUGHF66-32831-30 compatible with automated dispensing equipment?

    • Yes, IUGHF66-32831-30 can be dispensed using various automated equipment, providing flexibility in manufacturing processes.