Communication interface chip UART485/232
onsemi (Ansemi)
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The FUSB302B is targeted at system designers who want to implement DRP/SRC/SNK USB Type-C headers with minimal programming effort. The FUSB302B implements USB Type-C detection, including attachment and orientation. The FUSB302B integrates the physical layer of the USB BMC power delivery protocol, enabling up to 100 W of power and role swapping. The BMC PD device implements full support for other interfaces compliant with the Type-C specification. Reference regulations are available for the FUSB302B to easily implement Type-C and USB BMC power delivery protocols between several embedded controller platforms. Click on the "Software" link below.
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HGSEMI (Huaguan)
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ST (STMicroelectronics)
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TI (Texas Instruments)
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DP83848K Mini-LS, Industrial Temperature, Single Port 10/100Mb/s PHYTER? Ethernet Physical Layer Transceiver
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TI (Texas Instruments)
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MAX3222E 3V to 5V Multichannel RS-232 Line Driver/Receiver with +/-15kV ESD Protection
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onsemi (Ansemi)
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ADI/MAXIM (MAXIM)
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WCH(Nanjing Qinheng)
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PCI Bus Interface Chip
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RENESAS (Renesas)/IDT
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TI (Texas Instruments)
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RENESAS (Renesas)/IDT
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I-CORE (Zhongwei Love Core)
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onsemi (Ansemi)
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ADI/MAXIM (MAXIM)
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TI (Texas Instruments)
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TCAN1042HG Fail-Safe CAN Transceiver with Flexible Data Rate
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ADI/MAXIM (MAXIM)
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onsemi (Ansemi)
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The FSA642 is a bidirectional, low power, high speed analog switch. The pin-out design simplifies differential signal placement and is configured as a triple-pole double-throw switch (TPDT). The FSA642 is suitable for switching between two MIPI devices, such as a camera or LCD display, and an on-board multimedia application processor (MAP). The FSA642 is Mobile Industry Processor Interface (MIPI) compliant. The low capacitance design enables the FSA642 to switch signals at frequencies in excess of 500MHz. Excellent channel-to-channel crosstalk performance also minimizes interference to transmit high-speed differential and single-ended signals as specified by the MIPI specification.
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ADI/MAXIM (MAXIM)
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